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FC CSP Substrate
Grade：FR-4, PI、PTFE
Number Of Layers：2, 4, 6
Trace Width：12/12 μm to 25 μm/25 μm
SM Registration：±20 μm
Shanghai Mac Corporation is one of the leading and reliable manufacturers and exporters of FC CSP Substrate in China. We provide the high quality matched products and excellent services for various industries.
FC CSP Substrate is the key carrier for chip packaging, providing mechanical support, circuit interconnection and heat dissipation
channels for the chip, connecting the chip with the external circuit board, ensuring stable signal transmission,
and is widely used in various semiconductor devices.
If you want to know more about our FC CSP Substrate, please feel free to contact us, we will reply you within 24 hours.
Packaging of FC CSP Substrate：
Shanghai Mac Corporation Products are packed and labeled according to the regulations and customer's requests. Great care is taken to avoid any damage which might be caused during storage or transportation. In addition, clear labels are tagged on the outside of the packages for easy identification of the product I. D. and quality information.
1)SMC Standard
2)Customization
here
for
price
